ICP - IC PACKAGING TECHNOLOGY EXPO 2012
Exhibition Featuring all Kinds of Machinery, Parts and Materials for IC Packaging
Facts & Figures
Date: Jan. 18 - 20, 2012Cycle: once a year
City/Country: Tokyo, Japan
Relation Industry sectors:
Electronic Design & Components trade showsPower electronics trade shows
Venue:
Tokyo International Exhibition Center (Tokyo Big Sight)
TEL+81 (0)3 5530 1111
FAX+81 (0)3 5530 1222
Venue site: Go
Are you looking for hotels in Tokyo during fair periods?
Organizer of ICP - IC PACKAGING TECHNOLOGY EXPO:
Reed Exhibitions Japan
TEL+81 (0)3 3349-8501
FAX+81 (0)3 3349-8599
Organizer site: Go
Reed Exhibitions Companies
TEL+44 20 8271 2134
FAX+44 20 8910 7823
Organizer site: Go
More information about ICP - IC PACKAGING TECHNOLOGY EXPO:
Event Offical site: GoOfficial Email:
Event tools:
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No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.
