SMT HYBRID PACKAGING 2011

International Exhibition and Conference on System Integration in Micro Electronics

SMT HYBRID PACKAGING 2013, International Exhibition and Conference on System Integration in Micro Electronics



Facts & Figures

Date: May 03 - 05, 2011
Cycle: once a year
City/Country: Nuremberg, Germany

Relation Industry sectors:

Real Time Systems & Embedded Systems trade shows
Electronic Design & Components trade shows

Venue:


Nürnberg Meistersingerhalle
TEL+49 (0) 911 231 80 00
FAX+49 (0) 911 231 80 16

Venue site: Go

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Organizer of SMT HYBRID PACKAGING:


Mesago Messe & Kongress GmbH
TEL+49 (0) 711 61946 0
FAX+49 (0)711 61946 90

Organizer site: Go

More information about SMT HYBRID PACKAGING:

Event Offical site: Go
Official Email:

Event tools:


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No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.



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